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善仁新材料科技有限公司
Global leader in sintered silver—SHAREX launched Low-temperature sintered high thermally conductive die attach pastes AS9373 useing Nano silver
With the demand for high power electronics rapidly increasing, there is an ever growing need for high thermal conductivity adhesives that meet RoHs requirements. SHAREX has developed a pressureless, low temperature sintering silver useing our nano silver Technology reinforcement. The combination of these novel technologies results a durable die attach material with outstanding thermal conductivity of 260 W/m.K and electrical conductivity as low as 3.5μ ohm-cm. Please contact us for further information and samples.
Characteristics:High thermal conductivity;High adhesion strength;Dispensable or Jet Dispensable.
Applications:Power IC,SiC, GaN,LED,lasre chip and so so.
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